View TDA9183_2097320.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

d a t a sh eet objective speci?cation supersedes data of 2000 nov 22 file under integrated circuits, ic02 2000 nov 30 integrated circuits TDA9183 integrated ntsc comb filter
2000 nov 30 2 philips semiconductors objective speci?cation integrated ntsc comb ?lter TDA9183 features one-chip ntsc adaptive comb filter cross luminance reduction cross colour reduction no chroma trap, therefore sharper vertical luminance transients analog discrete-time signal processing, therefore no quantization noise anti-aliasing and reconstruction filters are included input switch selects between two y/cvbs inputs output switch selects between combed cvbs and an external y/c source f sc as well as 2 f sc colour subcarrier signal may be applied alignment free few external components low power. general description the TDA9183 is a an adaptive ntsc comb filter with two internal delay lines, filters, clock control and input clamps. the ntsc m video standard is supported. two cvbs input signals can be selected by means of an input switch. the selected cvbs input signal is filtered to obtain a combed luminance output signal and a combed chrominance output signal. switched capacitor circuit techniques are used, requiring an internal clock, locked on to the colour subcarrier frequency. the colour subcarrier frequency as well as twice the colour subcarrier frequency may be applied to the ic. in addition to the comb filter the circuit contains an output switch so that a selection can be made between the combed cvbs signal and an external y/c signal. the ic is available in a dip16 and so16 package. the supply voltage is 5 v. quick reference data ordering information symbol parameter min. typ. max. unit v cca analog supply voltage 4.5 5.0 5.5 v i cca analog supply current - 25 - ma v ddd digital supply voltage 4.5 5.0 5.5 v i ddd digital supply current - 10 - ma v i(y/cvbs)(p-p) luminance or cvbs input signal voltage (peak-to-peak value) 0.7 1.0 1.4 v v i(cin)(p-p) chrominance input signal voltage (peak-to-peak value) - 0.7 1.0 v v i(fsc)(p-p) colour subcarrier input signal voltage (peak-to-peak value) 100 200 400 mv v o(y/cvbs)(p-p) luminance or cvbs output signal voltage (peak-to-peak value) 0.6 1.0 1.54 v v o(cin)(p-p) chrominance output signal voltage (peak-to-peak value) - 0.7 1.1 v type number package name description version TDA9183p dip16 plastic dual in-line package; 16 leads (300 mil); long body sot38-4 TDA9183t so16 plastic small outline package; 16 leads; body width 7.5 mm sot162-1
2000 nov 30 3 philips semiconductors objective speci?cation integrated ntsc comb ?lter TDA9183 this text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the acrobat reader .this text is here in _ white to force landscape pages to be rotated correctly when browsing through the pdf in the acrobat reader.this text is here inthis text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the acrobat reader. white to force landscape pages to be ... block diagram handbook, full pagewidth mgt535 y/cvbs out c out 12 9 6 8 14 16 2 fsc fscsel v cca sandcastle detector clamp lpf lpf lpf clamp 10, 11 n.c. 15 outsel 13 agnd 4 dgnd 2h/4h delay adaptive comb filter y/cvbs 1 inpsel 3 y/cvbs 2 7 filter tuning (lpfs) 4 f sc clock generator sc 1 c in 5 v ddd TDA9183 fig.1 block diagram.
2000 nov 30 4 philips semiconductors objective speci?cation integrated ntsc comb ?lter TDA9183 pinning symbol pin description c in 1 chrominance signal input inpsel 2 input switch select input y/cvbs 2 3 luminance or cvbs signal 2 input dgnd 4 digital ground v ddd 5 digital supply voltage v cca 6 analog supply voltage sc 7 sandcastle signal input fscsel 8 colour subcarrier select input fsc 9 colour subcarrier signal input n.c. 10 not connected n.c. 11 not connected y/cvbs 1 12 luminance or cvbs signal 1 input agnd 13 analog ground (signal reference) y/cvbs out 14 luminance or cvbs signal output outsel 15 output switch select input c out 16 chrominance signal output handbook, halfpage TDA9183p mgt536 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 c in inpsel y/cvbs 2 dgnd v ddd v cca sc fscsel fsc n.c. n.c. y/cvbs 1 agnd y/cvbs out outsel c out fig.2 pin configuration (dip16). handbook, halfpage TDA9183t mgt537 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 c in inpsel y/cvbs 2 dgnd v ddd v cca sc fscsel fsc n.c. n.c. y/cvbs 1 agnd y/cvbs out outsel c out fig.3 pin configuration (so16).
2000 nov 30 5 philips semiconductors objective speci?cation integrated ntsc comb ?lter TDA9183 functional description input con?guration the y/cvbs 1 and y/cvbs 2 input signals are clamped by means of an internally generated clamp pulse which is derived from the sandcastle input signal (pin sc). if no sandcastle signal is available, a clamp pulse signal may be applied to pin sc. external clamp capacitors are needed. the buffered and clamped y/cvbs 1 and y/cvbs 2 signals are then applied to the input switch. the input switch select signal (inpsel) determines whether y/cvbs 1 or y/cvbs 2 is passed through to the anti-alias low-pass filter. this 3rd-order low-pass filter is optimized for best performance with respect to step response and clock suppression. the filtered signal is sampled at a clock frequency of four times the colour subcarrier frequency (f sc ). a colour subcarrier frequency signal is applied to pin fsc. the colour subcarrier select input signal (fscsel) indicates whether the colour subcarrier frequency (f sc )or twice the colour subcarrier frequency (2 f sc ) is being applied at the fsc input. an external coupling capacitor is needed for the colour subcarrier input signal. comb ?lter the sampled cvbs signal is applied to two delay lines. one delay line delays the signal over 1h (1h = one line-time). the direct and delayed signals are applied to an adaptive comb filter. the adaptive comb filter performs band-pass filtering around the colour subcarrier frequency and compares the contents of adjacent lines. in this way the combing of signals with different information is prevented and artifacts such as hanging dots are avoided. both the combed chrominance and the combed luminance signal are passed through a reconstruction low-pass filter to obtain continuous-time signals. these low-pass filters are 3rd-order, optimized for best performance with respect to step response and clock suppression. the reconstructed signals are applied to the output switches. output con?guration the luminance output switch selects between the reconstructed combed luminance signal and one of the buffered and clamped input signals y/cvbs 1 or y/cvbs 2 . the chrominance output switch selects between the reconstructed combed chrominance signal and the chrominance input signal (c in ). an external coupling capacitor is needed for c in . the selected signals are applied to the outputs y/cvbs out and c out respectively via a buffer stage. the output switch signal (outsel) determines whether the output switches select the internal combed signals or the external y/c signals. clock generation and ?lter tuning the clock generator is driven by a phase-locked loop (pll) circuit which generates a reference frequency of four times the colour subcarrier frequency. this pll circuit is phase-locked to the colour subcarrier input signal (fsc). several internal clock signals are derived from the 4 f sc reference. the filter tuning ensures the automatic alignment of the anti-alias and the reconstruction low-pass filters. a 4 f sc clock signal is used as a reference for the alignment. the tuning takes place each line during the line blanking and is initiated by means of an internally generated signal which is derived from the sandcastle input signal. if the output switches select external y/c signals the oscillator of the pll circuit is stopped regardless of the fsc input and no internal clock signals are generated. the filter tuning is also stopped.
2000 nov 30 6 philips semiconductors objective speci?cation integrated ntsc comb ?lter TDA9183 mode de?nitions table 1 general mode de?nitions; note 1 note 1. if the outsel pin is left open-circuit, the pin is pulled low by means of an internal pull-down resistor to analog ground (agnd). thus the comb mode can also be selected by not connecting the outsel pin. table 2 y/cvbs out output signal de?nitions table 3 c out output signal de?nitions table 4 input switch mode de?nitions; note 1 note 1. if the inpsel pin is left open-circuit, the pin is pulled low by means of an internal pull-down resistor to analog ground (agnd). thus the y/cvbs 1 input can also be selected by not connecting the inpsel pin. table 5 fsc mode de?nitions; note 1 note 1. if the fscsel pin is left open-circuit, the pin is pulled low by means of an internal pull-down resistor to analog ground (agnd). thus the f sc mode can also be selected by not connecting the fscsel pin. pin outsel mode low comb high yc mode y/cvbs out output signal comb comb ?ltered luminance signal yc y/cvbs 1 or y/cvbs 2 signal mode c out output signal comb comb ?ltered chrominance signal yc c in signal pin inpsel input switch mode low y/cvbs 1 input selected high y/cvbs 2 input selected pin fscsel fsc input signal frequency low f sc high 2 f sc
2000 nov 30 7 philips semiconductors objective speci?cation integrated ntsc comb ?lter TDA9183 limiting values in accordance with the absolute maximum rating system (iec 60134). notes 1. all pins are protected against esd by means of internal clamping diodes. 2. human body model (hbm): r = 1.5 k w ; c = 100 pf. 3. pins 5 (v ddd ) and 6 (v cca ): hbm: - 1500vTDA9183p 75 k/w TDA9183t 95 k/w
2000 nov 30 8 philips semiconductors objective speci?cation integrated ntsc comb ?lter TDA9183 characteristics v cca =v ddd =5v; t amb =25 c; input signal y/cvbs 1 = 1 v (p-p); input signal y/cvbs 2 = 1 v (p-p); input signal c in = 0.7 v (p-p); input signal fsc = 200 mv (p-p) sine wave at f sc ; input signal sc = 5 v (p-p) sandcastle signal; test signal: 100% white 75% amplitude fcc colour bar; source impedance for y/cvbs 1 and y/cvbs = 75 w ; coupled with 10 nf; source impedance for c in and fsc = 75 w ; coupled with 100 nf; load impedance for cvbs/y out and c out = 15 pf to analog ground (pin agnd); all voltages are related to analog ground (pin agnd); unless otherwise speci?ed. symbol parameter conditions min. typ. max. unit supplies v cca analog supply voltage 4.5 5.0 5.5 v i cca analog supply current - 25 - ma v ddd digital supply voltage 4.5 5.0 5.5 v i ddd digital supply current - 10 - ma p power dissipation - 175 - mw luminance or cvbs input 1 and 2; pins y/cvbs 1 and y/cvbs 2 v i(y/cvbs)(p-p) luminance or cvbs input voltage (peak-to-peak value) including sync 0.7 1.0 1.4 v t clamp(y/cvbs) clamp time constant - 20 - lines i i(y/cvbs) input current during clamping - 10 0 +10 m a during active video - 10 0 +10 na chrominance input; pin c in v i(cin)(p-p) chrominance input voltage (peak-to-peak value) - 0.7 1.0 v r i(cin) input resistance 30 -- k w colour subcarrier input; pin fsc v i(fsc)(p-p) subcarrier input voltage (peak-to-peak value) 100 200 400 mv d duty cycle square wave 40 50 60 % r i(fsc) input resistance 30 -- k w sandcastle input; pin sc v i(sc) sandcastle input voltage no clamping -- 3.3 v clamping 3.7 -- v t w pulse width clamping; note 1 2.6 --m s t w(rep) input pulse rising edge position with respect to the end of line blanking; note 1 --- 2.6 m s r i(sc) input resistance 1 -- m w c i(sc) input capacitance -- 2pf input switch select input; pin inpsel v il low-level input voltage y/cvbs 1 selected -- 0.5 v v ih high-level input voltage y/cvbs 2 selected 2.0 -- v r i(inpsel) input resistance 100 -- k w c i(inpsel) input capacitance -- 2pf
2000 nov 30 9 philips semiconductors objective speci?cation integrated ntsc comb ?lter TDA9183 output switch select input; pin outsel v il low-level input voltage comb mode -- 0.5 v v ih high-level input voltage yc mode 2.0 -- v r i(outsel) input resistance 100 -- k w c i(outsel) input capacitance -- 2pf colour subcarrier select input; pin fscsel v il low-level input voltage f sc at fsc input; note 2 -- 0.5 v v ih high-level input voltage 2 f sc at fsc input 2.0 -- v r i(fscsel) input resistance 100 -- k w c i(fscsel) input capacitance -- 2pf luminance output; pin y/cvbs out v o(y/cvbsout)(p-p) luminance output signal (peak-to-peak value) including sync 0.6 1.0 1.54 v e g(y) luminance gain error - 1 0 +1 db b - 3db(y) - 3 db luminance bandwidth comb mode 5 -- mhz yc mode 10 -- mhz t d(proc)(y) luminance processing delay comb mode; note 3 - 800 - ns yc mode - 15 - ns v clamp voltage level during clamping - 1.5 - v e bl black level error during blanking; note 4 - 10 0 +10 mv s/n luminance signal-to-noise ratio (1 v/v rms noise) unweighted; 200 khz to 5 mhz 56 -- db a ct crosstalk between different inputs 0 to 5 mhz --- 50 db f clk(res)(y) residues of clock frequencies in the luminance signal (v rms /1 v) comb mode; note 2 f=4 f sc --- 30 db f=2 f sc --- 30 db f = 1.33 f sc --- 30 db f=f sc --- 40 db fsc res(yc) fsc residue in yc mode (v rms /1 v) f=f sc ; f sc at fsc input; note 2 --- 60 db f=2 f sc ; 2 f sc at fsc input --- 60 db a ct crosstalk suppression at vertical transient black ?? multi-burst (1 v/v (p-p)) vertical transition active video ?? vertical blanking; note 5 and fig.5 26 -- db symbol parameter conditions min. typ. max. unit
2000 nov 30 10 philips semiconductors objective speci?cation integrated ntsc comb ?lter TDA9183 sup comb(y) suppression (comb depth) with respect to luminance band-pass nearest to f sc comb mode; note 2 and fig.6 f=f sc 30 -- db - 10 - db - 10 - db r o output resistance -- 500 w z l load impedance -- 15 pf chrominance output; pin c out v o(cout)(p-p) chrominance output signal (peak-to-peak value) - 0.7 1.1 v e g(chrom) chrominance gain error - 1 0 +1 db b - 3db(chrom) - 3 db chrominance bandwidth comb mode; around f sc ; note 2 1.5 -- mhz yc mode; base-band 10 -- mhz d t (proc)(y) difference with luminance processing delay - 020ns v dc dc voltage level - 1.5 - v s/n chrom chrominance signal-to-noise ratio (0.7 v/v rms noise) unweighted; f sc 0.3f sc ; note 2 56 -- db a ct crosstalk between different inputs 0 to 5 mhz --- 50 db f clk(res)(chrom) residues of clock frequencies in the chrominance signal (v rms /0.7 v) comb mode; note 2 f=4 f sc --- 30 db f=2 f sc --- 30 db f = 1.33 f sc --- 40 db f=f sc --- 50 db fsc res(yc) fsc residue in yc mode (v rms /0.7 v) f=f sc ;f sc at fsc input --- 60 db f=2 f sc ; 2 f sc at fsc input; note 2 --- 60 db a ct crosstalk suppression at vertical transient no-colour ?? colour [0.7 v/v (p-p)] vertical transition active video ?? vertical blanking; note 6 and fig.5 26 -- db symbol parameter conditions min. typ. max. unit f 227.5 59 C 227.5 --------------------------- f sc = f 227.5 59 + 227.5 --------------------------- - f sc =
2000 nov 30 11 philips semiconductors objective speci?cation integrated ntsc comb ?lter TDA9183 notes 1. the pulse should fall inside the line-blanking interval, after the rising edge of the synchronizing pulse. 2. f sc = colour subcarrier frequency; f sc = 3.579545 mhz for the ntsc m system. 3. with respect to 227.5 colour subcarrier periods (equals 63.556 m s) due to 1h delay in the comb filter. 4. with respect to the voltage level during clamping. 5. test signal for ntsc m: 100% amplitude fcc multi-burst (see fig.4). 6. test signal for ntsc m: 100% white 75% amplitude fcc colour bar. sup comb(chrom) suppression (comb depth) with respect to chrominance band pass at f = f sc comb mode; note 2 and fig.7 30 -- db 30 -- db 30 -- db r o output resistance -- 500 w z l load impedance -- 15 pf symbol parameter conditions min. typ. max. unit f 227 227.5 -------------- - f sc = f 227 59 C 227.5 ---------------------- f sc = f 227 59 + 227.5 ---------------------- - f sc = handbook, full pagewidth mgt522 (v) 0.5 1.5 2.0 3.0 3.58 4.1 mhz 1 0 0.30 0.15 0.45 0.65 fig.4 100% amplitude fcc multi-burst.
2000 nov 30 12 philips semiconductors objective speci?cation integrated ntsc comb ?lter TDA9183 handbook, full pagewidth mgt524 line n - 2 input line n - 1 line n + 1 line n + 2 line n + 3 line n line n - 2 output line n - 1 line n + 1 line n + 2 line n + 3 line n transition at top of field crosstalk crosstalk line n - 2 input line n - 1 line n + 1 line n + 2 line n + 3 line n line n - 2 output line n - 1 line n + 1 line n + 2 line n + 3 line n transition at bottom of field fig.5 vertical transitions active video ?? vertical blanking from line to line (ntsc system).
2000 nov 30 13 philips semiconductors objective speci?cation integrated ntsc comb ?lter TDA9183 handbook, full pagewidth mgt528 1 c cccc yy 0 detailed view comb depth at f = f sc 1 f sc 2 f sc yy 0.5 0 1 0.5 0 226 227.5 f sc 226.5 227.5 f sc 227 227.5 f sc 227.5 227.5 f sc 228 227.5 f sc 228.5 227.5 f sc 229 227.5 f sc 229.5 227.5 f sc 225.5 227.5 f sc fig.6 luminance transfer characteristic (ntsc m system).
2000 nov 30 14 philips semiconductors objective speci?cation integrated ntsc comb ?lter TDA9183 handbook, full pagewidth mgt532 1 yyyy cc 0 detailed view 1 f sc 2 f sc cc 0.5 0 1 0.5 0 226 227.5 f sc 226.5 227.5 f sc 227 227.5 f sc 227.5 227.5 f sc comb depth at f = 227 227.5 f sc 228 227.5 f sc 228.5 227.5 f sc 229 227.5 f sc 225.5 227.5 f sc fig.7 chrominance transfer characteristic (ntsc m system).
2000 nov 30 15 philips semiconductors objective speci?cation integrated ntsc comb ?lter TDA9183 application information handbook, full pagewidth mgt538 220 m h 100 nf c1 10 nf c3 l5 220 m h l6 5 v 100 nf c4 TDA9183 1 16 2 15 3 14 4 13 5 12 6 11 7 10 8 9 c in inpsel y/cvbs 2 sc fscsel fsc n.c. n.c. y/cvbs 1 y/cvbs out outsel c out 10 nf c12 100 nf 100 nf c9 c6 fig.8 application diagram.
2000 nov 30 16 philips semiconductors objective speci?cation integrated ntsc comb ?lter TDA9183 package outlines references outline version european projection issue date iec jedec eiaj sot38-4 92-11-17 95-01-14 m h c (e ) 1 m e a l seating plane a 1 w m b 1 b 2 e d a 2 z 16 1 9 8 e pin 1 index b 0 5 10 mm scale note 1. plastic or metal protrusions of 0.25 mm maximum per side are not included. unit a max. 12 b 1 (1) (1) (1) b 2 cd e e m z h l mm dimensions (inch dimensions are derived from the original mm dimensions) a min. a max. b max. w m e e 1 1.73 1.30 0.53 0.38 0.36 0.23 19.50 18.55 6.48 6.20 3.60 3.05 0.254 2.54 7.62 8.25 7.80 10.0 8.3 0.76 4.2 0.51 3.2 inches 0.068 0.051 0.021 0.015 0.014 0.009 1.25 0.85 0.049 0.033 0.77 0.73 0.26 0.24 0.14 0.12 0.01 0.10 0.30 0.32 0.31 0.39 0.33 0.030 0.17 0.020 0.13 dip16: plastic dual in-line package; 16 leads (300 mil) sot38-4
2000 nov 30 17 philips semiconductors objective speci?cation integrated ntsc comb ?lter TDA9183 unit a max. a 1 a 2 a 3 b p cd (1) e (1) (1) eh e ll p q z y w v q references outline version european projection issue date iec jedec eiaj mm inches 2.65 0.30 0.10 2.45 2.25 0.49 0.36 0.32 0.23 10.5 10.1 7.6 7.4 1.27 10.65 10.00 1.1 1.0 0.9 0.4 8 0 o o 0.25 0.1 dimensions (inch dimensions are derived from the original mm dimensions) note 1. plastic or metal protrusions of 0.15 mm maximum per side are not included. 1.1 0.4 sot162-1 8 16 w m b p d detail x z e 9 1 y 0.25 075e03 ms-013 pin 1 index 0.10 0.012 0.004 0.096 0.089 0.019 0.014 0.013 0.009 0.41 0.40 0.30 0.29 0.050 1.4 0.055 0.419 0.394 0.043 0.039 0.035 0.016 0.01 0.25 0.01 0.004 0.043 0.016 0.01 x q a a 1 a 2 h e l p q e c l v m a (a ) 3 a 0 5 10 mm scale so16: plastic small outline package; 16 leads; body width 7.5 mm sot162-1 97-05-22 99-12-27
2000 nov 30 18 philips semiconductors objective speci?cation integrated ntsc comb ?lter TDA9183 soldering introduction this text gives a very brief insight to a complex technology. a more in-depth account of soldering ics can be found in our data handbook ic26; integrated circuit packages (document order number 9398 652 90011). there is no soldering method that is ideal for all ic packages. wave soldering is often preferred when through-hole and surface mount components are mixed on one printed-circuit board. wave soldering can still be used for certain surface mount ics, but it is not suitable for fine pitch smds. in these situations reflow soldering is recommended. through-hole mount packages s oldering by dipping or by solder wave the maximum permissible temperature of the solder is 260 c; solder at this temperature must not be in contact with the joints for more than 5 seconds. the total contact time of successive solder waves must not exceed 5 seconds. the device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (t stg(max) ). if the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. m anual soldering apply the soldering iron (24 v or less) to the lead(s) of the package, either below the seating plane or not more than 2 mm above it. if the temperature of the soldering iron bit is less than 300 c it may remain in contact for up to 10 seconds. if the bit temperature is between 300 and 400 c, contact may be up to 5 seconds. surface mount packages r eflow soldering reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. typical reflow peak temperatures range from 215 to 250 c. the top-surface temperature of the packages should preferable be kept below 220 c for thick/large packages, and below 235 c for small/thin packages. w ave soldering conventional single wave soldering is not recommended for surface mount devices (smds) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. to overcome these problems the double-wave soldering method was specifically developed. if wave soldering is used the following conditions must be observed for optimal results: use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. for packages with leads on two sides and a pitch (e): C larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; C smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. the footprint must incorporate solder thieves at the downstream end. for packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. the footprint must incorporate solder thieves downstream and at the side corners. during placement and before soldering, the package must be fixed with a droplet of adhesive. the adhesive can be applied by screen printing, pin transfer or syringe dispensing. the package can be soldered after the adhesive is cured. typical dwell time is 4 seconds at 250 c. a mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. m anual soldering fix the component by first soldering two diagonally-opposite end leads. use a low voltage (24 v or less) soldering iron applied to the flat part of the lead. contact time must be limited to 10 seconds at up to 300 c. when using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 c.
2000 nov 30 19 philips semiconductors objective speci?cation integrated ntsc comb ?lter TDA9183 suitability of ic packages for wave, re?ow and dipping soldering methods notes 1. all surface mount (smd) packages are moisture sensitive. depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). for details, refer to the drypack information in the data handbook ic26; integrated circuit packages; section: packing methods . 2. for sdip packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board. 3. these packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 4. if wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. the package footprint must incorporate solder thieves downstream and at the side corners. 5. wave soldering is only suitable for lqfp, qfp and tqfp packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 6. wave soldering is only suitable for ssop and tssop packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. mounting package soldering method wave reflow (1) dipping through-hole mount dbs, dip, hdip, sdip, sil suitable (2) - suitable surface mount bga, lfbga, sqfp, tfbga not suitable suitable - hbcc, hlqfp, hsqfp, hsop, htqfp, htssop, sms not suitable (3) suitable - plcc (4) , so, soj suitable suitable - lqfp, qfp, tqfp not recommended (4)(5) suitable - ssop, tssop, vso not recommended (6) suitable -
2000 nov 30 20 philips semiconductors objective speci?cation integrated ntsc comb ?lter TDA9183 data sheet status note 1. please consult the most recently issued data sheet before initiating or completing a design. data sheet status product status definitions (1) objective speci?cation development this data sheet contains the design target or goal speci?cations for product development. speci?cation may change in any manner without notice. preliminary speci?cation quali?cation this data sheet contains preliminary data, and supplementary data will be published at a later date. philips semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. product speci?cation production this data sheet contains ?nal speci?cations. philips semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. definitions short-form specification ? the data in a short-form specification is extracted from a full data sheet with the same type number and title. for detailed information see the relevant data sheet or data handbook. limiting values definition ? limiting values given are in accordance with the absolute maximum rating system (iec 60134). stress above one or more of the limiting values may cause permanent damage to the device. these are stress ratings only and operation of the device at these or at any other conditions above those given in the characteristics sections of the specification is not implied. exposure to limiting values for extended periods may affect device reliability. application information ? applications that are described herein for any of these products are for illustrative purposes only. philips semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. disclaimers life support applications ? these products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. philips semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify philips semiconductors for any damages resulting from such application. right to make changes ? philips semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. philips semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
2000 nov 30 21 philips semiconductors objective speci?cation integrated ntsc comb ?lter TDA9183 notes
2000 nov 30 22 philips semiconductors objective speci?cation integrated ntsc comb ?lter TDA9183 notes
2000 nov 30 23 philips semiconductors objective speci?cation integrated ntsc comb ?lter TDA9183 notes
? philips electronics n.v. sca all rights are reserved. reproduction in whole or in part is prohibited without the prior written consent of the copyright owne r. the information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. no liability will be accepted by the publisher for any consequence of its use. publication thereof does not con vey nor imply any license under patent- or other industrial or intellectual property rights. internet: http://www.semiconductors.philips.com 2000 70 philips semiconductors C a worldwide company for all other countries apply to: philips semiconductors, marketing communications, building be-p, p.o. box 218, 5600 md eindhoven, the netherlands, fax. +31 40 27 24825 argentina: see south america australia: 3 figtree drive, homebush, nsw 2140, tel. +61 2 9704 8141, fax. +61 2 9704 8139 austria: computerstr. 6, a-1101 wien, p.o. box 213, tel. +43 1 60 101 1248, fax. +43 1 60 101 1210 belarus: hotel minsk business center, bld. 3, r. 1211, volodarski str. 6, 220050 minsk, tel. +375 172 20 0733, fax. +375 172 20 0773 belgium: see the netherlands brazil: see south america bulgaria: philips bulgaria ltd., energoproject, 15th floor, 51 james bourchier blvd., 1407 sofia, tel. +359 2 68 9211, fax. +359 2 68 9102 canada: philips semiconductors/components, tel. +1 800 234 7381, fax. +1 800 943 0087 china/hong kong: 501 hong kong industrial technology centre, 72 tat chee avenue, kowloon tong, hong kong, tel. +852 2319 7888, fax. +852 2319 7700 colombia: see south america czech republic: see austria denmark: sydhavnsgade 23, 1780 copenhagen v, tel. +45 33 29 3333, fax. +45 33 29 3905 finland: sinikalliontie 3, fin-02630 espoo, tel. +358 9 615 800, fax. +358 9 6158 0920 france: 51 rue carnot, bp317, 92156 suresnes cedex, tel. +33 1 4099 6161, fax. +33 1 4099 6427 germany: hammerbrookstra?e 69, d-20097 hamburg, tel. +49 40 2353 60, fax. +49 40 2353 6300 hungary: see austria india: philips india ltd, band box building, 2nd floor, 254-d, dr. annie besant road, worli, mumbai 400 025, tel. +91 22 493 8541, fax. +91 22 493 0966 indonesia: pt philips development corporation, semiconductors division, gedung philips, jl. buncit raya kav.99-100, jakarta 12510, tel. +62 21 794 0040 ext. 2501, fax. +62 21 794 0080 ireland: newstead, clonskeagh, dublin 14, tel. +353 1 7640 000, fax. +353 1 7640 200 israel: rapac electronics, 7 kehilat saloniki st, po box 18053, tel aviv 61180, tel. +972 3 645 0444, fax. +972 3 649 1007 italy: philips semiconductors, via casati, 23 - 20052 monza (mi), tel. +39 039 203 6838, fax +39 039 203 6800 japan: philips bldg 13-37, kohnan 2-chome, minato-ku, tokyo 108-8507, tel. +81 3 3740 5130, fax. +81 3 3740 5057 korea: philips house, 260-199 itaewon-dong, yongsan-ku, seoul, tel. +82 2 709 1412, fax. +82 2 709 1415 malaysia: no. 76 jalan universiti, 46200 petaling jaya, selangor, tel. +60 3 750 5214, fax. +60 3 757 4880 mexico: 5900 gateway east, suite 200, el paso, texas 79905, tel. +9-5 800 234 7381, fax +9-5 800 943 0087 middle east: see italy netherlands: postbus 90050, 5600 pb eindhoven, bldg. vb, tel. +31 40 27 82785, fax. +31 40 27 88399 new zealand: 2 wagener place, c.p.o. box 1041, auckland, tel. +64 9 849 4160, fax. +64 9 849 7811 norway: box 1, manglerud 0612, oslo, tel. +47 22 74 8000, fax. +47 22 74 8341 pakistan: see singapore philippines: philips semiconductors philippines inc., 106 valero st. salcedo village, p.o. box 2108 mcc, makati, metro manila, tel. +63 2 816 6380, fax. +63 2 817 3474 poland : al.jerozolimskie 195 b, 02-222 warsaw, tel. +48 22 5710 000, fax. +48 22 5710 001 portugal: see spain romania: see italy russia: philips russia, ul. usatcheva 35a, 119048 moscow, tel. +7 095 755 6918, fax. +7 095 755 6919 singapore: lorong 1, toa payoh, singapore 319762, tel. +65 350 2538, fax. +65 251 6500 slovakia: see austria slovenia: see italy south africa: s.a. philips pty ltd., 195-215 main road martindale, 2092 johannesburg, p.o. box 58088 newville 2114, tel. +27 11 471 5401, fax. +27 11 471 5398 south america: al. vicente pinzon, 173, 6th floor, 04547-130 s?o paulo, sp, brazil, tel. +55 11 821 2333, fax. +55 11 821 2382 spain: balmes 22, 08007 barcelona, tel. +34 93 301 6312, fax. +34 93 301 4107 sweden: kottbygatan 7, akalla, s-16485 stockholm, tel. +46 8 5985 2000, fax. +46 8 5985 2745 switzerland: allmendstrasse 140, ch-8027 zrich, tel. +41 1 488 2741 fax. +41 1 488 3263 taiwan: philips semiconductors, 5f, no. 96, chien kuo n. rd., sec. 1, taipei, taiwan tel. +886 2 2134 2451, fax. +886 2 2134 2874 thailand: philips electronics (thailand) ltd., 60/14 moo 11, bangna trad road km. 3, bagna, bangkok 10260, tel. +66 2 361 7910, fax. +66 2 398 3447 turkey: yukari dudullu, org. san. blg., 2.cad. nr. 28 81260 umraniye, istanbul, tel. +90 216 522 1500, fax. +90 216 522 1813 ukraine : philips ukraine, 4 patrice lumumba str., building b, floor 7, 252042 kiev, tel. +380 44 264 2776, fax. +380 44 268 0461 united kingdom: philips semiconductors ltd., 276 bath road, hayes, middlesex ub3 5bx, tel. +44 208 730 5000, fax. +44 208 754 8421 united states: 811 east arques avenue, sunnyvale, ca 94088-3409, tel. +1 800 234 7381, fax. +1 800 943 0087 uruguay: see south america vietnam: see singapore yugoslavia: philips, trg n. pasica 5/v, 11000 beograd, tel. +381 11 3341 299, fax.+381 11 3342 553 printed in the netherlands 753504/25/02/pp 24 date of release: 2000 nov 30 document order number: 9397 750 07804

▲Up To Search▲

Price & Availability of TDA9183

	To Download TDA9183 Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .